Sizzix Die Brush & Foam Padfor Wafer thin Dies

Sizzix Die Brush & Foam Padfor Wafer thin Dies
Varenr.
Siz660513
Pris
kr 149,00

Kvantumsrabatt

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Sizzix Die Brush Tool 5.5"X1.75"X1.25"

Sizzix-Die Brush Tool. Designed to instantly remove leftover paper from chemically-etched dies, wafer-thin dies and cut out designs. The sleek, ergonomic rubber-grip handle allows for non-slip and easy maneuverability as it smoothly rolls away excess paper. This package contains 5-1/2x1-3/4x1-1/4 inch die brush tool and one 7x4- 1/2x1/2 inch foam pad.

Pakkens dimensjoner: Width 5.75 in / 14.61 cm Height 9.5 in / 24.13 cm Depth 2.5 in / 6.35 cm

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